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Ships within 48 hours · Estimated delivery Jul 26 - Jul 31
Field Upgrade ASW 1260 Inf II Bin
Estimated Packed Shipping Dimensions: 12" x 12"x 12" @ 18 lbs
EPROM: 23835U2-1
Part No: 5386278-001
img{max-width:100%} Novellus Systems 02-402743-00 MCA Shelve 26 Slot LL Elevator 300mm Wafer New
TEL Tokyo Electron 5010-593909-11 TCN Upper Cup Rudolph Technologies F30 New Field Upgrade ASW 1260 InfTEL Tokyo Electron 5010 593909 11 TCN Upper Cup Rudolph Technologies F30 New Part No: 5010 593909 11 SS5010 593909 11 CUP, UPPER For use with a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Made in Japan This is new surplus. The physical condition is great. Sale Details Item Condition: New, 90 Day Warranty Estimated Packed Shipping Dimensions: L x W x H = 20"x20"x20" @ 10 lbs. Shipping Terms: All Domestic and International
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US$ 125.00